AI Optical Interconnect Firm Ligent Technologies Launches Hong Kong IPO
Ligent Technologies, a global optical communication and interconnect platform company, officially launched its Hong Kong public offering on September 14, planning to list on the Main Board of the Hong Kong Stock Exchange. Citigroup and CITIC Securities act as joint sponsors.
The company has been deeply engaged in the optical communication industry for more than two decades and is one of the few global players capable of both R&D and mass production of optical chips and optical modules. Its revenue exceeded RMB 8.3 billion in 2025.
Ligent provides core optical communication products for AI computing networks, covering cloud computing, big data and fiber-optic networks. In 2026, its self-developed optical chips achieved mass production adoption by leading customers, marking a key milestone in its "chip-module integration" strategy.
The company operates four smart manufacturing bases in Qingdao, Jiangmen, Thailand and the United States, along with four R&D centers in Qingdao, Wuhan, Silicon Valley and Singapore. Its product matrix includes 800G and 1.6T optical modules in volume production, with 3.2T and 6.4T optical engines in reserve. Ligent holds 1,581 global patents and has contributed to 61 industry standards.
Proceeds from the IPO will be used to advance NPO/CPO and high-end chip commercialization, expand advanced production capacity, and strengthen overseas marketing networks and strategic M&A along the industrial chain.
