Teradyne Launches UltraFLEXplus S-Series Test Platform for Edge AI

On October 27, Teradyne, a global supplier of automated test equipment and robotics, announced the launch of the UltraFLEXplus S-Series semiconductor manufacturing equipment platform. As an extension of the UltraFLEXplus platform, the series is designed for semiconductor manufacturing needs in edge AI applications, aiming to support high-mix, variable-volume production while improving output per unit area and operational efficiency.

The first model, UltraFLEXplus S24, is a 24-slot system that serves both engineering development and high-volume production, addressing the cost-efficiency requirements of integrated device manufacturers (IDMs) and outsourced semiconductor assembly and test (OSAT) providers.