TSMC Reportedly Weighs 10–20% Price Increase for CoWoS Advanced Packaging

TSMC is reportedly considering a 10%–20% price increase for its CoWoS advanced packaging services, driven by surging AI demand and tight semiconductor supply chain capacity, according to media reports.

CoWoS is an advanced packaging technology offered by TSMC. The potential increase comes as AI-related demand continues to strain packaging capacity across the industry.

The news follows growing supply constraints in the semiconductor sector. SK Hynix said in its latest earnings release that memory chip shortages are expected to last until 2030, with quarterly profitability yet to peak. TSMC has also raised its 2026 capital expenditure outlook to $60–64 billion, up about $8 billion from its previous forecast.

SEMI projects global semiconductor manufacturing equipment sales to reach a record $165.9 billion in 2026 and $229.5 billion by 2028, as AI infrastructure investment accelerates fab expansion and advanced packaging capacity growth.