Huawei Details AI DC Solutions with 128K-Card Cluster at Connect 2026

On September 17, 2026, during HUAWEI CONNECT 2026, Huawei hosted the AI DC Innovation Summit. Ma Haixu, Huawei's Vice President and President of ICT Product Portfolio Management & Solutions, delivered a keynote speech on the evolution of data centers toward AI DC in the Agentic era, introducing Huawei's innovations in intelligent computing, general-purpose computing and storage, and network facilities.

Ma said data centers are transforming into AI DCs with higher power and density. AI facilities are being redefined with liquid cooling, high-voltage DC power supply, and 3D data centers; AI infrastructure is shifting to intelligent computing supernodes, high-density CPUs, tiered KV Cache storage, and ultra-high-bandwidth low-latency networks; and AI applications are becoming Agent-centric, with massive numbers of agents and EB-level multimodal data driving the construction of agent infrastructure.

Huawei introduced several solutions: a new intelligent computing supernode based on the Lingqu architecture, with the Atlas 960 liquid-cooled supernode delivering up to 8 EFLOPS; a supernode cluster supporting up to 128,000 cards, reducing TCO by 30% with simplified networking and minute-level fault recovery; a KV Cache multi-level caching solution achieving over 90% hit rate; the Kunpeng 950 supernode and AI high-performance storage for large-scale agent inference; and a lightweight inference integration solution for edge deployment, tripling inference performance. Huawei also showcased ultra-wide lossless data center networks and a 3D data center design.

Huawei said it will continue to build an open computing ecosystem around Ascend and Kunpeng to support industry intelligence.