Synopsys and TSMC Expand Collaboration on A14 Process and AI-Assisted Chip Design

On September 23, Synopsys announced a deepened collaboration with TSMC focused on advanced A14 process technology, AI-agent-assisted design, CoWoS multi-die packaging, and co-packaged optics (CPO). The companies plan to expand TSMC's 2nm IP portfolio, including tapeouts of PCIe 7.0 and HBM4 IP, while using AI agents to automate analog, digital, and multi-die design flows. Synopsys also said the two firms will advance TSMC's COUPE technology for CPO design validation and 3DFabric-based multi-die design.