Huawei Mate 90 Pro Max Launches with Kirin 9050 Pro Logic-Folding τ Chip

At its Mate 90 series and all-scenario new product launch event on October 1, Huawei's Richard Yu, Executive Director and Chairman of the Consumer Business Group, announced that the Mate 90 Pro Max flagship smartphone is powered by the Kirin 9050 Pro logic-folding τ chip, which achieves a transistor density of 238 million per mm², a 28% increase.

The Kirin 9050 Pro processor was previously unveiled on September 7 during the HarmonyOS 7 and HUAWEI Mate XT 2 launch event. The new chip marks Huawei's first flagship Kirin processor introduced at a flagship launch event in six years, following the Mate 40 global launch, and is described as a logic-folding τ chip.

Huawei, a global leading provider of ICT infrastructure and smart devices, introduced the Mate 90 Pro Max as the latest addition to its flagship smartphone lineup.