On October 14, GlobalFoundries announced it had been selected as the technology provider and operator for two new semiconductor wafer fabs in New York State. The project is backed by US-Japan cooperation with investment up to $21 billion; Japan provides funding while GlobalFoundries handles technology and operations. The first fab is expected to cost about $10 billion and begin production in 2029.
TSMC has signed a five-year, $2 billion agreement with GlobalFoundries to produce silicon interposers for CoWoS packaging at GlobalFoundries' New York plant, with production ramping up in the first half of 2028. It is TSMC's first outsourcing of silicon interposers, marking the extension of a key AI packaging step to the United States.