Hikvision Unit Debuts Sub-Micron 3D AXI System, Bringing AI to Industrial X-Ray Inspection

At the 2026 China International Industry Fair, Hikvision's industrial X-ray business unit unveiled a high-precision 3D AXI system for semiconductor packaging inspection. The system achieves sub-micron measurement, 3D image reconstruction and defect analysis while maintaining reliability and consistency, targeting advanced packaging and laboratory failure analysis markets.

Wang Wei, president of the unit, said the product differs from conventional X-ray inspection equipment. Besides production-line inspection, it can serve research institutes and laboratories as a metrology tool. Sub-micron means below one micron, entering the nanometer scale, and only a handful of players globally can enter this field.

Wang emphasized that AI is becoming a key variable in industrial X-ray. The company has combined X-ray with AI for full inspection of foldable phone hinges, cutting defect rates by an order of magnitude across issues such as foreign matter, cracks, voids and missing parts. In meat processing, where X-ray was mainly used for bone and foreign object detection, the addition of image AI algorithms and large-model capabilities has enabled fat content analysis.

Wang added that future X-ray equipment will evolve into "intelligent robotic tools" that can automatically detect and understand defects, adjust parameters, and feed inspection data back to optimize upstream processes. Based on the Hikvision Guanlan large model, the company has reduced the sample size needed for new inspection categories from thousands to one or two hundred images, and to around ten images for similar new models.