SK Hynix R&D Chief Sees 20-Fold AI Infrastructure Growth by 2030, Details Next-Gen Memory

SK Hynix R&D head Ahn Hyun said on Oct. 14 that the performance scale of AI infrastructure is expected to grow about 20-fold by 2030. Ahn said the memory chip maker is developing next-generation memory technologies, including 3D stacked DRAM and high-bandwidth flash memory (HBF), while continuing to improve the performance of its existing HBM products.