During an interview at the 2026 China International Industry Fair, the president of Hikvision's industrial X-ray unit said the company unveiled a high-precision 3D AXI system for semiconductor packaging inspection, achieving sub-micron measurement, 3D image reconstruction and defect analysis for advanced packaging and lab failure analysis. He noted that X-ray combined with AI has been applied to foldable-screen hinge inspection and meat fat detection, and future equipment will evolve into intelligent robotic tools.