At the GTC conference in Berlin, Nvidia CEO Jensen Huang said a memory oversupply by 2029 is unlikely, that HBM will continue to be used for years, and noted Nvidia was the first to bring LPDDR memory into data centers with twice the energy efficiency of global alternatives.
Micron hosted its 2026 technical symposium, outlining its outlook for DRAM, HBM, NAND and SSDs. It expects to introduce two new 3DS memory types, vHBM and vEIM, in 2028 alongside standard HBM5. vHBM is a 3D-integrated HBM stacking DRAM dies, a base die and an XPU logic die; vEIM targets on-device AI inference, with first-generation goals of 2TB/s bandwidth and <1pJ/bit efficiency.
Musk responded on X to the chip stock selloff triggered by ChangXin Memory's technology breakthrough, saying that once China figures out how to manufacture a product, its scaling capacity often exceeds that of the rest of the world combined, citing lithium batteries and solar as examples. He noted China is rapidly tackling universal standard specs like LP5 and LP6, while pointing out that HBM architecture, SRAM layers, and 3D-stacked RAM heat dissipation remain harder challenges.
Samsung Electronics has set its HBM4 supply price for next year at a mid-to-high range of $4 per gigabit, more than three times the price of HBM3E, and has started annual contract negotiations with major customers, according to a South Korean media report on October 2.