Micron hosted its 2026 technical symposium, outlining its outlook for DRAM, HBM, NAND and SSDs. It expects to introduce two new 3DS memory types, vHBM and vEIM, in 2028 alongside standard HBM5. vHBM is a 3D-integrated HBM stacking DRAM dies, a base die and an XPU logic die; vEIM targets on-device AI inference, with first-generation goals of 2TB/s bandwidth and <1pJ/bit efficiency.