xMEMS announced that its µCooling all-silicon solid-state active cooling chips have entered mass production. The chips use high-frequency expansion and contraction of piezoelectric materials on silicon to generate ultrasonic mechanical motion, converted into high-speed air pulses through a micro-valve array, with a thickness of only 1.13mm and IP68 dust/water resistance. The mass-produced models include the mid-size XMC-2400 (28ml/s flow, 1300Pa back pressure, for XR glasses and other edge AI devices) and the large-size XMC-4800 (48ml/s flow, 1100Pa back pressure, for smartphones and data center SSDs).