xMEMS Begins Mass Production of All-Silicon Solid-State Active Cooling Chips

xMEMS announced on October 13 that its µCooling all-silicon solid-state active cooling chips have entered mass production. The company, a startup in the MEMS field, uses thin-film piezoelectric material on silicon that expands and contracts at high frequency to generate ultrasonic mechanical motion. A precision micro-valve array on the chip converts this motion into high-speed air pulses that carry heat away from the source.

The chip measures as thin as 1.13mm and carries an IP68 dust and water resistance rating. The initial mass-produced models include the mid-size XMC-2400, which delivers 28ml/s airflow and 1300Pa back pressure for XR glasses and other edge AI devices, and the large-size XMC-4800, offering 48ml/s airflow and 1100Pa back pressure for smartphones and data center SSDs.