In a video released on Oct 4, 2026, Huawei's Yu Chengdong said Huawei Semiconductor has designed and mass-produced 381 τ chips in areas including phones, AI, general-purpose computing, networking, and intelligent vehicles. He also introduced the "time (τ) scaling" Tao law and LogicFolding core technologies, with high-end chip transistor density expected to reach 1.4nm-equivalent levels by 2031.