Biwin Storage announced it will invest CNY4.5 billion in the third phase of a wafer-level advanced memory packaging and testing project in Dongguan Songshan Lake High-Tech Industrial Development Zone, Guangdong Province, implemented by its controlled subsidiary Guangdong Xincheng Hanqi Semiconductor. The project will be built on the existing base land, with total investment expected to be completed by the end of 2029. Driven by AI computing demand fueling memory market growth, the company's share price once surged 5.2% that day.