At DAC, experts from Synopsys, Silvaco, Vinci, Keysight, and Siemens (Mentor) joined a Semiconductor Engineering roundtable on thermal management and thermal-related trade-offs in chip and system design, covering thermal effects as architectural constraints, growing analysis complexity from chiplets and advanced packaging, the need for multiphysics modeling and digital twins, new cooling approaches such as thermal interface materials and immersion cooling, and thermal simulation extending down to device level.