According to supply chain sources, ChangXin Memory recently declined to quote Apple for DRAM supply, prioritizing the Chinese domestic market. In August, Apple's price-cut request for LPDDR5X and other mobile DRAM had been rejected. ChangXin's capacity is fully booked by long-term orders from domestic terminal makers.
Musk responded on X to the chip stock selloff triggered by ChangXin Memory's technology breakthrough, saying that once China figures out how to manufacture a product, its scaling capacity often exceeds that of the rest of the world combined, citing lithium batteries and solar as examples. He noted China is rapidly tackling universal standard specs like LP5 and LP6, while pointing out that HBM architecture, SRAM layers, and 3D-stacked RAM heat dissipation remain harder challenges.
In an interview, Mr. P of P Equity Research said hyperscalers' 10-year demand visibility is unreliable, memory will remain cyclical, and estimated 2027 hyperscaler capex at $1.1T-$1.2T with memory at $500B-$700B. He identified power, advanced packaging and memory as compute bottlenecks, noted ABF substrate shortages may last into the 2030s, gas turbine orders are booked beyond 2030, and CPO dominance will wait until after 2030.
The 5th GMIF 2026 Innovation Summit was held in Shenzhen on September 23, co-organized by the Shenzhen Memory Industry Association and Peking University's School of Integrated Circuits. Focusing on storage technology evolution, industry trends and application innovation in the AI era, executives from Samsung, Sandisk, Arm, Biwin Storage and Lenovo shared views on HBF high-bandwidth NAND, multi-media heterogeneous storage, Token factories and AI computing operations.
Biwin Storage announced it will invest CNY4.5 billion in the third phase of a wafer-level advanced memory packaging and testing project in Dongguan Songshan Lake High-Tech Industrial Development Zone, Guangdong Province, implemented by its controlled subsidiary Guangdong Xincheng Hanqi Semiconductor. The project will be built on the existing base land, with total investment expected to be completed by the end of 2029. Driven by AI computing demand fueling memory market growth, the company's share price once surged 5.2% that day.
Sugon released its upgraded AI inference-native storage FN Neo, which uses a pooled shared architecture for cluster-level KV Cache scheduling. It delivers 160GB/s bandwidth per array with sub-millisecond latency, cuts first-token response time by 73%, boosts token throughput by 150%, offers 99.999% reliability, and supports frameworks like vLLM, LMCache, and Mooncake.
On September 20, at the 2026 World Manufacturing Convention, CXMT announced mass production of its fifth-generation technology platform, featuring a memory array active-area half pitch of 11.95nm and wafer output per wafer over 50% higher than the previous generation under the same conditions. The 24GB LPDDR5X based on the platform has entered volume production and is now fully used in mainstream domestic flagship smartphones.
ChangXin Memory Technologies' EBIT margin reached 82% in Q2 2026, surpassing major memory chipmakers including SK Hynix (76%), Micron, and Samsung Electronics' semiconductor business (70%), making it the world's most profitable memory chipmaker that quarter. Its revenue grew about 10 times year-on-year.
Kioxia CEO Hiroo Ota said memory prices have risen enough and instructed the business team not to significantly raise prices for data center customers, to avoid dampening AI industry investment. He said another 70% quarter-over-quarter price increase is unlikely, but the priority is to keep chip prices high, and denied joint production talks with SK Hynix.