On October 12, Nvidia and Cisco jointly unveiled USFP, a new ultra-high-density pluggable optical module standard. The first product supports 400Gb/s electrical signaling per lane with four times the bandwidth density of existing solutions. The companies are collaborating with TE Connectivity and Amphenol on hardware ecosystem development and plan to advance USFP into an open industry specification through a community-led multi-source project. No product launch or mass-production timeline has been disclosed.
On September 30, Synopsys announced a multi-year custom chip IP strategic cooperation agreement with Amazon, totaling over $1 billion, expanding collaboration to cloud and AI-enabled engineering R&D. Synopsys will provide chip IP and AI-driven engineering software, leverage AWS to accelerate product iteration, optimize its tools for Trainium and Graviton chips, and introduce Amazon EC2 and Amazon Bedrock to its engineering teams.
Synopsys and OpenAI have signed a multi-year, legally binding agreement to jointly develop GPT-Synopsys, a specialized semiconductor design model combining OpenAI's advanced AI technology with Synopsys' electronic design automation (EDA) tools.
Lens Technology executives said the company posted H1 2026 revenue of RMB 28.866 billion and net profit of RMB 577 million, down 49.5% year on year, while Q2 net profit reached RMB 726 million, turning profitable quarter on quarter with gross margin at 18.2%. The company has approved a $3 billion derivatives quota for FX hedging. Foldable phone structural parts shipped in late Q2 and are now in volume delivery. Lens Intelligent's H1 revenue rose 43%; the Yong'an campus has capacity for 500,000 embodied AI robots, and mass supply of modules and dexterous hand components for leading customers began in Q3. The company positions itself as an embodied AI "chain leader" and core manufacturing service provider, developing "cerebellum-cerebrum" platform software.
On September 23, Synopsys announced a deepened collaboration with TSMC on A14 advanced process, AI-agent-assisted design, CoWoS multi-chip packaging, and co-packaged optics, while expanding the 2nm IP portfolio and completing tapeouts for PCIe 7.0 and HBM4 IP.
Cisco announces a major restructuring to focus on AI and high-growth markets, cutting about 4,000 jobs (under 5% of global workforce), mainly in Q4. CEO Robbins