On September 30, Synopsys announced a multi-year custom chip IP strategic cooperation agreement with Amazon, totaling over $1 billion, expanding collaboration to cloud and AI-enabled engineering R&D. Synopsys will provide chip IP and AI-driven engineering software, leverage AWS to accelerate product iteration, optimize its tools for Trainium and Graviton chips, and introduce Amazon EC2 and Amazon Bedrock to its engineering teams.
Synopsys and OpenAI have signed a multi-year, legally binding agreement to jointly develop GPT-Synopsys, a specialized semiconductor design model combining OpenAI's advanced AI technology with Synopsys' electronic design automation (EDA) tools.
On September 23, Synopsys announced a deepened collaboration with TSMC on A14 advanced process, AI-agent-assisted design, CoWoS multi-chip packaging, and co-packaged optics, while expanding the 2nm IP portfolio and completing tapeouts for PCIe 7.0 and HBM4 IP.