Micron hosted its 2026 technical symposium, outlining its outlook for DRAM, HBM, NAND and SSDs. It expects to introduce two new 3DS memory types, vHBM and vEIM, in 2028 alongside standard HBM5. vHBM is a 3D-integrated HBM stacking DRAM dies, a base die and an XPU logic die; vEIM targets on-device AI inference, with first-generation goals of 2TB/s bandwidth and <1pJ/bit efficiency.
At Micron's fiscal 2026 annual earnings call, the CFO said humanoid robots will become a new engine for memory demand, with each device requiring over 200GB of DRAM and several TB of NAND flash. Physical AI will become a significant driver of memory demand by the end of this decade, and memory prices are unlikely to fall even if the AI bubble bursts. The company also reported Q4 FY2026 revenue of $54.23 billion, up 379% year over year, and guided Q1 FY2027 revenue to $61.5 billion.
Burry said he is converting short positions in AI-related stocks including Micron, Nebius, SOXX semiconductor ETF and Palantir into put options to gain more cost-effective leverage over a shorter time frame, and said the AI bubble could burst sooner than expected.
Sumit Sadana, senior advisor to Micron's CEO, said the memory shortage now covers all market segments and customer demand keeps being revised upward. He expects meaningful new supply to start ramping only in 2028, with no clear timeline for supply-demand balance.
At the Six Five Summit 2026, Sumit Sadana, senior adviser to Micron's CEO, said memory has become the core bottleneck determining AI performance, with meaningful new capacity not arriving until after 2028. He disclosed Micron's capex plans: over $13 billion in fiscal 2025, doubled in fiscal 2026, and more than $45 billion expected in fiscal 2027, plus a $250 billion U.S. investment. He also said humanoid robots will become the largest incremental memory market, requiring hundreds of GB of DRAM and several TB of NAND per device.
Micron announced on September 15 that it has completed demonstration and validation of the world's first 512GB DDR5 RDIMM memory module. Featuring TSV vertical stacking, the module raises dual-socket server memory capacity to over 12TB and cuts power consumption by more than 60% compared with a four-128GB-module configuration. AMD and Intel have started validation, with volume production expected in the second half of 2027.
U.S. AI-related stocks tumbled on Sept. 14 amid concerns about a slowdown in AI development, with Nvidia, Micron, and Intel falling 3.36%, 5.25%, and 5.59%, respectively. All three major indices closed lower.