Faraday Technology announced in its Q3 2026 earnings a major design win from a US customer for a cloud-oriented AI chip based on Samsung's 2nm process, featuring vertical stacking of logic SoC and custom DRAM with hybrid bonding and PCIe Gen6 support. The project sets company records in design process, complexity, NRE amount, and advanced packaging.
Samsung Electronics Chairman Lee Jae-yong visited the company's Seoul R&D campus and inspected the Robotics Experience (RX) business division for the first time since its establishment in July, reviewing progress in humanoid robot arm and dexterous hand technologies planned for display at CES 2027.
Samsung's new flagship chip Exynos 2700 surpassed Qualcomm's flagship chip in internal test scores, showing strong performance.
On October 21, media reported that Samsung Electronics and SK Hynix plan to upgrade their Chinese plants to produce NAND flash chips with over 200 stacked layers, in response to AI storage demand growth and to counter YMTC's competition. Samsung's Xi'an plant aims to convert lines to 286-layer V9 NAND, targeting 5,000 wafers per month by December 2026; SK Hynix plans to upgrade its Dalian plant to 240 layers or above.
At IEDM 2026 on December 14, 2026, Samsung Foundry presented its second-generation 8LPU+ platform for expanding its 8nm process. The new platform delivers 12% higher performance, 15% lower power consumption and 8% smaller chip area than the previous 8LPU, and uses an EUV-free approach with existing DUV lines, targeting edge AI, robotics and automotive chips.
Samsung Electronics will reportedly use TSMC's 3nm process to produce base chips for NVIDIA's next-generation custom high-bandwidth memory (HBM), marking their first collaboration in HBM manufacturing. NVIDIA has asked Samsung, SK hynix, and Micron to use TSMC's process for NVHBM base chips, and Samsung accepted after internal review while keeping its in-house production for standard HBM and other clients.
At Seoul Design Week 2026, Samsung's Chief Design Officer Mauro Porcini said the company adheres to a human-centered design philosophy, integrating AI with human emotional intelligence and imagination. He described AI as a tool to help people unleash creativity rather than replace them, and said human critical thinking, creativity and sensitivity are the core competitiveness of product design, a principle applied across Samsung's TVs, smartphones and home appliances.
Samsung showcased next-generation memory and storage technologies at the 2026 OCP Global Summit, and demonstrated a CXL-based memory expansion solution jointly with AMD.
On October 12, Samsung unveiled its new Galaxy Tab S12 series AI tablets, upgrading display, performance, and AI productivity on the basis of a large screen and ultra-slim design. The devices combine Galaxy AI with multitasking capabilities and come with a bundled S Pen that requires no charging or pairing, supporting note assistant, Bixby, AI-powered photo problem-solving, and an English speaking tutor.
ASML has notified Samsung Electronics and SK Hynix of a uniform 10% price increase for replacement parts supplied in South Korea, covering all EUV and DUV lithography machine components, effective January 2027.