During the 2026 Huawei Connect, Xu Zhijun and Huawei semiconductor chief scientist Liao Heng reviewed Ascend chip progress (Ascend 950 launched, Atlas 950 supernode in delivery, 256,000-card cluster being deployed, Atlas 960 in testing) and introduced the Peerium computing architecture, the UnifiedBus interconnect, and the Ascend 960 supernode, described as the world's first NPO-based supernode.
During HUAWEI CONNECT 2026, Wu Jiaxing, President of Huawei's Data Communication Product Line Security Domain, proposed using AI to fight AI and shifting security from rule-driven to AI-driven. He positioned AIFW as the next-generation firewall, co-led the AIFW technical standard with more than 20 organizations, and launched security solutions for AI computing centers, including the Xinghe AI three-layer security fence to address risks such as compute theft, prompt injection and model poisoning.
At Huawei Connect 2026, Huawei released the "AI Deployment Seven-Step Method" and the "DIMAK Engineering System" to tackle the challenge of deeply embedding Agentic AI into core industry scenarios. Tao Jingwen, Deputy Chairman of Huawei's Supervisory Board, delivered a keynote proposing to build a "road and bridge" between computing power and scenarios with new methods, organizations, and tools, while also releasing the "Agentic Enterprise" white paper and 157 digital transformation case studies.
At the Huawei Cloud Summit during HUAWEI CONNECT 2026, Gu Xuejun delivered a keynote introducing Huawei Cloud Stack's All for AI upgrades across cloud infrastructure, data, AI, and ecosystem, unveiled the agent-oriented hybrid cloud architecture Next, and set goals such as raising computing power utilization from 30% to 70%.
At HUAWEI CONNECT 2026 on Sept 18, Huawei Cloud CEO Zhou Yuefeng gave a keynote on building Agentic Cloud, proposing that making tokens more efficient is the core of infrastructure in the agent era, and released the Agentic Infra paradigm. He announced that the Lunqu Ascend 950 AI computing cluster service will go commercial in China on Sept 30 and overseas on Nov 30, while Zhiguo AgentArts will be commercially available overseas on Dec 30. The Industry AI Dreamworks also launched new government services and AI hardware zones.
At the AI DC Innovation Summit held during HUAWEI CONNECT 2026 on September 17, 2026, Huawei VP Ma Haixu delivered a keynote on the evolution of data centers toward AI DC in the Agentic era, introducing innovations including a new intelligent computing supernode, a 128,000-card supernode cluster, a KV Cache multi-level caching solution, a Kunpeng supernode, a lightweight inference solution, and 3D data centers.
At Huawei Connect's Ascend Industry Summit on September 17, 2026, Huawei VP Zhang Xiwei said Ascend R&D investment in 2026 and 2027 has exceeded Huawei's wireless division, supporting stable output of Ascend 960/970/980; over 1,000 supernodes have been deployed with more than 650 million online card-hours, and over 40 large models have completed pre-training. He also said domestic AI training compute investment could reach hundreds of billions to trillions of yuan.
Huawei announced at Huawei Connect that its next-generation Ascend 960DT AI chip will launch in Q1 2027, earlier than the originally planned Q3 2027. Eric Xu said the Ascend 960 chip will arrive ahead of schedule with doubled performance, in a move to challenge Nvidia.
At HUAWEI CONNECT 2026, Huawei unveiled the Ascend 960 supernode, the industry's first to use NPO technology. A single supernode features 4,096 cards, delivering up to 8E FP8 computing power and 1PB of HBM capacity. Huawei also upgraded the Kunpeng supernode and launched the OceanStor M900 AI memory storage system.
At the Huawei Connect conference, Wang Tao introduced Huawei's seven major initiatives for the intelligent era, including an AI strategy centered on computing power, building a solid computing power foundation for China, fostering an open-source computing ecosystem, focusing Pangu large models on product intelligence, offering flexible computing power solutions, advancing diverse computing power to bring AI to devices and vehicles, and constructing a new generation of communication networks.